JPS6127194Y2 - - Google Patents

Info

Publication number
JPS6127194Y2
JPS6127194Y2 JP1979150287U JP15028779U JPS6127194Y2 JP S6127194 Y2 JPS6127194 Y2 JP S6127194Y2 JP 1979150287 U JP1979150287 U JP 1979150287U JP 15028779 U JP15028779 U JP 15028779U JP S6127194 Y2 JPS6127194 Y2 JP S6127194Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
substrate
wiring
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979150287U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5667774U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979150287U priority Critical patent/JPS6127194Y2/ja
Publication of JPS5667774U publication Critical patent/JPS5667774U/ja
Application granted granted Critical
Publication of JPS6127194Y2 publication Critical patent/JPS6127194Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1979150287U 1979-10-29 1979-10-29 Expired JPS6127194Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979150287U JPS6127194Y2 (en]) 1979-10-29 1979-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979150287U JPS6127194Y2 (en]) 1979-10-29 1979-10-29

Publications (2)

Publication Number Publication Date
JPS5667774U JPS5667774U (en]) 1981-06-05
JPS6127194Y2 true JPS6127194Y2 (en]) 1986-08-13

Family

ID=29381326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979150287U Expired JPS6127194Y2 (en]) 1979-10-29 1979-10-29

Country Status (1)

Country Link
JP (1) JPS6127194Y2 (en])

Also Published As

Publication number Publication date
JPS5667774U (en]) 1981-06-05

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